Materials: Polyimide film
EDHD Copper: 1/3, 1/2, 1.0 and 2.0 Oz/SF (0.012, 0.018, Copper 0.035, 0.070mm) etc.
RA Copper: 1/3, 1/2, 1.0 and 2.0 Oz/SF (0.012, 0.018, 0.035, 0.070mm) etc.
Board thickness: - 0.08mm-5mm
Copper weight: 0.5 OZ --- 5 OZ
Mini line width/space: 3mil/3mil
Mini finished Hole Size: 0.2mm
Surface treatment: HASL, LF HASL , Plating Gold, Immersion gold, OSP.